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Proceedings Paper

Application of machine learning techniques to semiconductor manufacturing
Author(s): Keki B. Irani; Jie Cheng; Usama M. Fayyad; Zhaogang Qian
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Paper Abstract

The advancement of VLSI technology has reached the stage where the automation of semiconductor manufacturing has become imminent. A natural step towards this end is to apply the available expert system technology to the task of intelligent control, monitoring and diagnosis of various processes and equipment for the IC manufacturing environment. This paper gives an overview of a machine learning program (GID3) and its use in automating the knowledge acquisition needed for the construction of an expert system for controlling the Reactive Ion Etching (RIE) process in IC manufacturing. We argue the appropriateness and necessity of machine learning to circumvent the “knowledge acquisition bottleneck”. We then motivate and describe the learning algorithm we developed. The GID3 system was applied to five different projects with several SRC industrial institutions. We describe some of the application areas where an acceptable level of success was achieved by the program. The application areas include: identification of relationships between RIE process anomalies and the corresponding parameter settings, acquiring a set of rules for correcting RIE process parameters contributing to abnormal output, and knowledge acquisition for an emitter piloting advisory expert system. The main theme of this paper is to bring attention to machine learning as a useful tool in the automation of the IC manufacturing process and as an aid to engineers in interpreting and assimilating experimental results.

Paper Details

Date Published: 1 January 1990
PDF: 10 pages
Proc. SPIE 1293, Applications of Artificial Intelligence VIII, (1 January 1990); doi: 10.1117/12.21147
Show Author Affiliations
Keki B. Irani, Univ. of Michigan (United States)
Jie Cheng, Univ. of Michigan (United States)
Usama M. Fayyad, Univ. of Michigan (United States)
Zhaogang Qian, Univ. of Michigan (United States)


Published in SPIE Proceedings Vol. 1293:
Applications of Artificial Intelligence VIII
Mohan M. Trivedi, Editor(s)

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