Share Email Print
cover

Proceedings Paper

All-optical GaAs switching and modulation for space applications
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In response to the need for radiation hardened optoelectronic integrated circuits (OEICs) and systems, Physical Optics Corporation (POC) in cooperation with the University of New Mexico proposed to design, develop, and fabricate special OEIC units based on an open modular Light Distributing Interconnective Active (LIDIA) architecture. This design will alleviate most problems associated with electrical interconnects, and will be optimized from the perspective of system survivability, radiation hardening, high I/O bandwidth, built-in testing (BIT), packaging density, electrical power budget, thermal (heat) management, and electrical isolation. The proposed concept will include GaAs waveguides, vertical cavity surface emitting lasers (VCSEL--developed by the University of New Mexico), electro-optical modulators and all optical switches. The proposed optical interconnect concept will be applied for chip-to-chip data communications as well as for board-to-board data transmission in a 3D packaging configuration.

Paper Details

Date Published: 30 May 1995
PDF: 11 pages
Proc. SPIE 2482, Photonics for Space Environments III, (30 May 1995); doi: 10.1117/12.210524
Show Author Affiliations
Andrew A. Kostrzewski, Physical Optics Corp. (United States)
Tomasz P. Jannson, Physical Optics Corp. (United States)
Vladimir Katsman, Physical Optics Corp. (United States)
Marek Osinski, Univ. of New Mexico (United States)
Ray T. Chen, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 2482:
Photonics for Space Environments III
Edward W. Taylor, Editor(s)

© SPIE. Terms of Use
Back to Top