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Proceedings Paper

Integration of electronic circuits with light modulators and lasers using direct bonding techniques for smart pixel applications
Author(s): Volkan H. Ozguz
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Paper Abstract

The integration of electronic logic and processing circuits of various complexity with sensing and actuating elements is needed for the realization of 'Smart' structures. Direct bonding techniques relies on topotoaxial integration of two dissimilar materials, one in thin film and the other in bulk forms. These techniques can deliver new smart structures by combining sensing and/or actuation components with high complexity logic circuits while preserving their performance. Integration of ferroelectric ceramics, multiple quantum well modulators and lasers with Si and GaAs electronic circuits is already demonstrated. Potential future implementation of the direct bonding technique will include the bonding of various electronic circuits to nonplanar, flexible and deformable substrates and combination with micromechanical structures.

Paper Details

Date Published: 26 May 1995
PDF: 12 pages
Proc. SPIE 2448, Smart Structures and Materials 1995: Smart Electronics, (26 May 1995); doi: 10.1117/12.210471
Show Author Affiliations
Volkan H. Ozguz, Univ. of California/San Diego (United States)


Published in SPIE Proceedings Vol. 2448:
Smart Structures and Materials 1995: Smart Electronics
Vijay K. Varadan, Editor(s)

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