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Proceedings Paper

High-aspect-ratio resist for thick-film applications
Author(s): Nancy C. LaBianca; Jeffrey D. Gelorme
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Paper Abstract

In recent years, increased activity in micromachining has driven the need for high aspect ratio thick films resist systems. This paper discusses a new epoxy based resist that can be used to achieve high aspect ratios (> 10:1) using UV lithography. The resulting negative resist system provides sharp, clean images in thick films (> 200 micrometers ). Because of the high aspect ratio and short exposure times, this material may be a viable candidate for producing the images required for micromachined parts. The resist images exhibit straight sidewalls and developed patterns, have excellent thermal stability, good adhesion, and chemical resistance. The high aspect ratio and high thermal stability make these epoxy resists suitable for other packaging applications such as plating stencils and optical wave guides.

Paper Details

Date Published: 9 June 1995
PDF: 7 pages
Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210413
Show Author Affiliations
Nancy C. LaBianca, IBM Thomas J. Watson Research Ctr. (United States)
Jeffrey D. Gelorme, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 2438:
Advances in Resist Technology and Processing XII
Robert D. Allen, Editor(s)

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