Share Email Print
cover

Proceedings Paper

Studies on the adhesion contact angle of various substrates and their photoresist profiles
Author(s): Chang-Ming Dai; Daniel Hao-Tien Lee
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The relationships of contact angle among different substrates, the role of dehydrating bake on photoresist profile and the relationship between contact angle and photoresist profile are addressed in this paper. Generally speaking, when the HMDS priming time increases, the contact angle of all the substrates increases no matter what the adhesion priming temperature and dehydrating bake time/temperature used. Among these substrates, tungsten silicide always has the largest contact angle and its minimum acceptable priming time is about 5 seconds. Regarding the priming temperature, largest contact angle is obtained with priming temperature around 50 degree(s)C for doped poly, bare silicon, and tungsten silicide substrates, while for Teos substrates there is no significance difference on priming temperature as it's beyond larger than 30 degree(s)C. In terms of dehydration temperature, lower baking temperature results in larger contact angle. However, as far as the photoresist profile is concerned, higher contact angle does not guarantee that profile is vertical without undercut or tailing problems. In view of improving the photoresist profile, the dehydrating bake is unavoidable and the temperature should be around 100 degree(s)C.

Paper Details

Date Published: 9 June 1995
PDF: 8 pages
Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210406
Show Author Affiliations
Chang-Ming Dai, Industrial Technology Research Institute (Taiwan)
Daniel Hao-Tien Lee, VISC (Taiwan)


Published in SPIE Proceedings Vol. 2438:
Advances in Resist Technology and Processing XII
Robert D. Allen, Editor(s)

© SPIE. Terms of Use
Back to Top