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Proceedings Paper

Thermal rearrangement of novolak resins used in microlithography
Author(s): Ricky Hardy; Anthony Zampini; Michael J. Monaghan; Michael J. O'Leary; William J. Cardin; Timothy J. Eugster
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Paper Abstract

Changes in phenolic-formaldehyde resin properties are described in terms of thermal exposure. At high temperature, resin molecular weight, dissolution properties and chemical composition change depending on the presence or absence of monomers. Without monomer in the resin melt at 220 degree(s)C, resin molecular weight increases with a corresponding decrease in dissolution rate. In the presence of monomer, molecular weight generally decreases. Dissolution rate may fluctuate depending on the monomer mixture. Three,five- Xylenol and 2,3,5-trimethylphenol co-monomers induced the most extreme changes in resin properties with thermal treatment. Resin degradation-recombination processes suggest a classical Friedel-Craft rearrangement mechanism.

Paper Details

Date Published: 9 June 1995
PDF: 10 pages
Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210390
Show Author Affiliations
Ricky Hardy, Shipley Co. Inc. (United States)
Anthony Zampini, Shipley Co. Inc. (United States)
Michael J. Monaghan, Shipley Co. Inc. (United States)
Michael J. O'Leary, Shipley Co. Inc. (United States)
William J. Cardin, Shipley Co. Inc. (United States)
Timothy J. Eugster, Shipley Co. Inc. (United States)

Published in SPIE Proceedings Vol. 2438:
Advances in Resist Technology and Processing XII
Robert D. Allen, Editor(s)

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