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Proceedings Paper

Shape-memory characteristics of sputter-deposited Ti-Ni-base thin films
Author(s): Shuichi Miyazaki; Takanori Hashinaga; Kazuya Yumikura; Hiroshi Horikawa; Tatsuhiko Ueki; Akira Ishida
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Paper Abstract

Ti-Ni-Cu and Ti-Ni-Pd ternary shape memory alloy thin films were made by sputtering. They showed smaller temperature hysteresis and higher transformation temperatures, respectively, than those of Ti-Ni binary thin films; these characteristics are effective to achieve a high response actuator characteristic. The transformation temperatures and shape memory behavior were characterized by DSC measurement and thermal cycling tests under a variety of constant stresses, respectively. The Ti-Ni-Pd thin film showed a single stage transformation both upon cooling and heating similarly to a Ti-Ni binary alloy thin film which was also made in the present report; the transformation occurred between the parent B2 phase and martensite M(monoclinic)-phase. Correspondingly, they showed a single stage deformation both upon cooling and heating. The Ti-Ni-Cu thin film showed a two-stage transformation and hence a two-stage deformation; the first stage corresponds to the transformation between B2 and O(Orthorhombic)-phase and the second stage between the O- and M-phases. The first stage transformation was accompanied by a small temperature hysteresis. All these thin films showed perfect shape memory effect.

Paper Details

Date Published: 22 May 1995
PDF: 9 pages
Proc. SPIE 2441, Smart Structures and Materials 1995: Smart Materials, (22 May 1995); doi: 10.1117/12.209795
Show Author Affiliations
Shuichi Miyazaki, Univ. of Tsukuba (Japan)
Takanori Hashinaga, Univ. of Tsukuba (Japan)
Kazuya Yumikura, Univ. of Tsukuba (Japan)
Hiroshi Horikawa, Furukawa Techno Material Co., Ltd. (Japan)
Tatsuhiko Ueki, Furukawa Electric Co., Ltd. (Japan)
Akira Ishida, National Research Institute for Metals (Japan)

Published in SPIE Proceedings Vol. 2441:
Smart Structures and Materials 1995: Smart Materials
A. Peter Jardine, Editor(s)

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