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Proceedings Paper

Characterization of 5-X stepper lenses to improve depth of focus
Author(s): David P. Paul; Maurice A. Hamel; Ken A. Lavallee
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Paper Abstract

In the fabrication of integrated circuits, device pattern size determines electrical performance characteristics. Variations in the size of lines, trenches, contacts, straps, etc. result in electrical device performance differences. When the variations occur from chip to chip or wafer to wafer, we find that entire chips function differently (e.g. impacts clock speeds). This paper discusses within-chip variations that can produce undesirable effects which, when severe enough, can kill an entire chip because portions of it have incompatible electrical performance. The modeling and characterization of image-size variations caused by lens aberrations of 5X photolithography steppers with lens field sizes from 15 mm2 to 22 mm2 are also discussed.

Paper Details

Date Published: 26 May 1995
PDF: 10 pages
Proc. SPIE 2440, Optical/Laser Microlithography VIII, (26 May 1995); doi: 10.1117/12.209293
Show Author Affiliations
David P. Paul, IBM Microelectronics Div. (United States)
Maurice A. Hamel, IBM Microelectronics Div. (United States)
Ken A. Lavallee, IBM Microelectronics Div. (United States)


Published in SPIE Proceedings Vol. 2440:
Optical/Laser Microlithography VIII
Timothy A. Brunner, Editor(s)

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