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Proceedings Paper

First results of outgas resist family test and correlation between outgas specifications and EUV resist development
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Paper Abstract

In this paper, we present the first results of witness sample based outgas resist family test to improve the efficiency of outgas testing using EUV resists that have shown proven imaging performance. The concept of resist family testing is to characterize the boundary conditions of outgassing scale from three major components for each resist family. This achievement can significantly reduce the cost and improve the resist outgas learning cycle. We also report the imaging performance and outgas test results of state of the art resists and discuss the consequence of the resist development with recent change of resist outgassing specifications. Three chemically amplified resists selected from higher outgassing materials are investigated, but no significant improvement in resist performance is observed.

Paper Details

Date Published: 16 March 2015
PDF: 9 pages
Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 942211 (16 March 2015); doi: 10.1117/12.2087424
Show Author Affiliations
Yu-Jen Fan, SEMATECH Inc. (United States)
Ken Maruyama, JSR Micro, Inc. (United States)
Ramakrishnan Ayothi, JSR Micro, Inc. (United States)
Takehiko Naruoka, JSR Micro, Inc. (United States)
Tonmoy Chakraborty, SEMATECH Inc. (United States)
Dominic Ashworth, SEMATECH Inc. (United States)
Jun Sung Chun, SEMATECH Inc. (United States)
College of Nanoscale Science and Engineering (United States)
Cecilia Montgomery, SEMATECH Inc. (United States)
Shih-Hui Jen, SEMATECH Inc. (United States)
Mark Neisser, SEMATECH Inc. (United States)
Kevin Cummings, SEMATECH Inc. (United States)


Published in SPIE Proceedings Vol. 9422:
Extreme Ultraviolet (EUV) Lithography VI
Obert R. Wood; Eric M. Panning, Editor(s)

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