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Proceedings Paper

Directed self-assembly of topcoat-free, integration-friendly high-X block copolymers
Author(s): Eri Hirahara; Margareta Paunescu; Orest Polishchuk; EunJeong Jeong; Edward Ng; Jianhui Shan; Jihoon Kim; SungEun Hong; Durairaj Baskaran; Guanyang Lin; Ankit Vora; Melia Tjio; Noel Arellano; Charles T. Rettner; Elizabeth Lofano; Chi-Chun Liu; Hsinyu Tsai; Anindarupa Chunder; Khanh Nguyen; Alexander M. Friz; Amy N. Bowers; Srinivasan Balakrishnan; Joy Y. Cheng; Daniel P. Sanders
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Paper Abstract

To extend scaling beyond poly(styrene-b-methyl methacrylate) (PS-b-PMMA) for directed self-assembly (DSA), high quality organic high-x block copolymers (HC series) were developed and applied to implementation of sub-10 nm L/S DSA. Lamellae-forming block copolymers (BCPs) of the HC series showed the ability to form vertically oriented polymer domains conveniently with the in-house PS-r-PMMA underlayers (AZEMBLY EXP NLD series) without the use of an additional topcoat. The orientation control was achieved with low bake temperatures (≤200 °C) and short bake times (≤5 min). Also, these process-friendly materials are compatible with existing 193i-based graphoepitaxy and chemoepitaxy DSA schemes. In addition, it is notable that 8.5 nm organic lamellae domains were amenable to pattern development by simple dry etch techniques. These successful demonstrations of high-x L/S DSA on 193i-defined guiding patterns and pattern development can offer a feasible route to access sub-10 nm node patterning technology.

Paper Details

Date Published: 20 March 2015
PDF: 11 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250P (20 March 2015); doi: 10.1117/12.2087398
Show Author Affiliations
Eri Hirahara, EMD Performance Materials Corp. (United States)
Margareta Paunescu, EMD Performance Materials Corp. (United States)
Orest Polishchuk, EMD Performance Materials Corp. (United States)
EunJeong Jeong, EMD Performance Materials Corp. (United States)
Edward Ng, EMD Performance Materials Corp. (United States)
Jianhui Shan, EMD Performance Materials Corp. (United States)
Jihoon Kim, EMD Performance Materials Corp. (United States)
SungEun Hong, EMD Performance Materials Corp. (United States)
Durairaj Baskaran, EMD Performance Materials Corp. (United States)
Guanyang Lin, EMD Performance Materials Corp. (United States)
Ankit Vora, IBM Research - Almaden (United States)
Melia Tjio, IBM Research - Almaden (United States)
Noel Arellano, IBM Research - Almaden (United States)
Charles T. Rettner, IBM Research - Almaden (United States)
Elizabeth Lofano, IBM Research - Almaden (United States)
Chi-Chun Liu, IBM Thomas J. Watson Research Ctr. (United States)
Hsinyu Tsai, IBM Albany Nanotech (United States)
Anindarupa Chunder, IBM Research - Almaden (United States)
Khanh Nguyen, IBM Research - Almaden (United States)
Alexander M. Friz, IBM Research - Almaden (United States)
Amy N. Bowers, IBM Research - Almaden (United States)
Srinivasan Balakrishnan, IBM Research - Almaden (United States)
Joy Y. Cheng, IBM Research - Almaden (United States)
Daniel P. Sanders, IBM Research - Almaden (United States)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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