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Proceedings Paper

Overlay metrology solutions in a triple patterning scheme
Author(s): Philippe Leray; Ming Mao; Bart Baudemprez; Nuriel Amir
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Paper Abstract

Overlay metrology tool suppliers are offering today several options to their customers: Different hardware (Image Based Overlay or Diffraction Based Overlay), different target designs (with or without segmentation) or different target sizes (from 5 um to 30 um). All these variations are proposed to resolve issues like robustness of the target towards process variations, be more representative of the design or increase the density of measurements.

In the frame of the development of a triple patterning BEOL scheme of 10 nm node layer, we compare IBO targets (standard AIM, AIMid and multilayer AIMid). The metrology tools used for the study are KLA-Tencor’s nextgeneration Archer 500 system (scatterometry- and imaging-based measurement technologies on the same tool).

The overlay response and fingerprint of these targets will be compared using a very dense sampling (up to 51 pts per field). The benefit of indie measurements compared to the traditional scribes is discussed. The contribution of process effects to overlay values are compared to the contribution of the performance of the target. Different targets are combined in one measurement set to benefit from their different strengths (performance vs size).

The results are summarized and possible strategies for a triple patterning schemes are proposed.

Paper Details

Date Published: 24 March 2015
PDF: 8 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94240E (24 March 2015); doi: 10.1117/12.2087304
Show Author Affiliations
Philippe Leray, IMEC (Belgium)
Ming Mao, IMEC (Belgium)
Bart Baudemprez, IMEC (Belgium)
Nuriel Amir, KLA-Tencor (Israel)


Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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