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Proceedings Paper

Block co-polymer approach for CD uniformity and placement error improvement in DSA hole grapho-epitaxy process
Author(s): Tasuku Matsumiya; Tsuyoshi Kurosawa; Masahito Yahagi; Hitoshi Yamano; Ken Miyagi; Takaya Maehashi; Issei Suzuki; Akiya Kawaue; Yoshitaka Komuro; Taku Hirayama; Katsumi Ohmori
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Paper Abstract

Directed Self-Assembly (DSA) of Block Co-Polymer (BCP) with conventional lithography is being thought as one of the potential patterning solution for future generation devices manufacturing. Many studies have been reported to fabricate the aligned patterns both on grapho and chemoepitaxy for semiconductor application1, 2. The hole shrink and multiplication by graphoepitaxy are one of the DSA implementation candidates in terms of relatively realistic process and versatility of chip design. The critical challenges on hole shrink and multiplication by using conventional Poly (styrene-b-methyl methacrylate) (PS-b-PMMA) BCP have been reported such as CD uniformity, placement error3 and defectivity. It is needed to overcome these challenging issues by improving not only whole process but materials. From the material aspect, the surface treatment material for guide structure, and process friendly BCP material are key development items on graphoepitaxy. In this paper, it will be shown in BCP approach about conventional PS-b-PMMA with additives and new casting solvent as PS-b-PMMA extension for CD uniformity and placement error improvement and then it’ll be discussed on what is the key factor and solution from BCP material approach.

Paper Details

Date Published: 20 March 2015
PDF: 6 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 942517 (20 March 2015); doi: 10.1117/12.2087009
Show Author Affiliations
Tasuku Matsumiya, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Tsuyoshi Kurosawa, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Masahito Yahagi, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Hitoshi Yamano, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Ken Miyagi, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Takaya Maehashi, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Issei Suzuki, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Akiya Kawaue, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Yoshitaka Komuro, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Taku Hirayama, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Katsumi Ohmori, Tokyo Ohka Kogyo Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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