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Proceedings Paper

Evaluation of novel processing approaches to improve extreme ultraviolet (EUV) photoresist pattern quality
Author(s): Cecilia Montgomery; Jun Sung Chun; Yu-Jen Fan; Shih-Hui Jen; Mark Neisser; Kevin D. Cummings; Warren Montgomery; Takashi Saito; Lior Huli; David Hetzer; Hiroie Matsumoto; Andrew Metz; Vinayak Rastogi
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Paper Abstract

Recently there has been a great deal of effort focused on increasing EUV scanner source power; which is correlated to increased wafer throughput of production systems. Another way of increasing throughput would be to increase the photospeed of the photoresist used. However increasing the photospeed without improving the overall lithographic performance, such as local critical dimension uniformity (L-CDU) and process window, does not deliver the overall improvements required for a high volume manufacturing (HVM). This paper continues a discussion started in prior publications [Ref 3,4,6], which focused on using readily available process tooling (currently in use for 193 nm double patterning applications) and the existing EUV photoresists to increase photospeed (lower dose requirement) for line and space applications. Techniques to improve L-CDU for contact hole applications will also be described.

Paper Details

Date Published: 20 March 2015
PDF: 12 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 942526 (20 March 2015); doi: 10.1117/12.2086982
Show Author Affiliations
Cecilia Montgomery, SEMATECH Inc. (United States)
Jun Sung Chun, SEMATECH Inc. (United States)
SUNY College of Nanoscale Science and Engineering (United States)
Yu-Jen Fan, SEMATECH Inc. (United States)
Shih-Hui Jen, SEMATECH Inc. (United States)
Mark Neisser, SEMATECH Inc. (United States)
Kevin D. Cummings, SEMATECH Inc. (United States)
Warren Montgomery, SUNY College of Nanoscale Science and Engineering (United States)
Takashi Saito, TEL Technology Ctr., America, LLC (United States)
Lior Huli, TEL Technology Ctr., America, LLC (United States)
David Hetzer, TEL Technology Ctr., America, LLC (United States)
Hiroie Matsumoto, TEL Technology Ctr., America, LLC (United States)
Andrew Metz, TEL Technology Ctr., America, LLC (United States)
Vinayak Rastogi, TEL Technology Ctr., America, LLC (United States)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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