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Proceedings Paper

Wafer to wafer overlay control algorithm implementation based on statistics
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Paper Abstract

For mass production of DRAM device, a stable and effective overlay control becomes more and more important as DRAM design rule shrinks. Existent technologies were already applied to overcome this situation. Nevertheless, we are still suffered from tight overlay margin and forced to move from lot-based to wafer-based overlay control. However, the wafer-based control method requires a huge amount of measurement resource.

In this paper, we present the insight for the wafer-based overlay correction with optimal measurement resource which is suitable for mass production. The experiment which is the wafer-based overlay correction by several statistical analyses carried out for 2X nm node DRAM. Among them, linear regression is a strong candidate for wafer-based overlay control, which improved up to 0.8 nm of maximum overlay.

Paper Details

Date Published: 26 March 2015
PDF: 8 pages
Proc. SPIE 9426, Optical Microlithography XXVIII, 942614 (26 March 2015); doi: 10.1117/12.2086936
Show Author Affiliations
Byeong Soo Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Young Seog Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jeong Heung Kong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Hyun Woo Hwang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Myeong Gyu Song, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9426:
Optical Microlithography XXVIII
Kafai Lai; Andreas Erdmann, Editor(s)

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