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Proceedings Paper

Real time decision based multiple mode SEM review imaging solution
Author(s): Huina Xu; Harsh Sinha; Garry Chen; White Pai; Jung Yan Yang; Charles Tsai
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Paper Abstract

Embedded defect types continue to be a challenge for scanning electron microscopes (SEM) review solutions. Though high energy beams can be used to image these defect types, they cause damage to the reviewed sites. Also, imaging all review sites at higher electron energy has often resulted in low topography surface defects to be non-visible due to high penetration depth. In this work we present a method in which defects are reviewed at non-destructive lower electron energies and only the non-visual review sites are reviewed at higher electron energies to image any potential additional defect types. The non-visual defects are identified inline during review using automatic defect classification attributes.

Paper Details

Date Published: 19 March 2015
PDF: 6 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94242G (19 March 2015); doi: 10.1117/12.2086505
Show Author Affiliations
Huina Xu, KLA-Tencor Corp. (United States)
Harsh Sinha, KLA-Tencor Corp. (United States)
Garry Chen, United Microelectronics Corp. (Taiwan)
White Pai, United Microelectronics Corp. (Taiwan)
Jung Yan Yang, United Microelectronics Corp. (Taiwan)
Charles Tsai, United Microelectronics Corp. (Taiwan)


Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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