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Proceedings Paper

Patterning sub-25nm half-pitch hexagonal arrays of contact holes with chemo-epitaxial DSA guided by ArFi pre-patterns
Author(s): Arjun Singh; Boon Teik Chan; Doni Parnell; Hengpeng Wu; Jian Yin; Yi Cao; Roel Gronheid
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Paper Abstract

The patterning potential of block copolymer (BCP) materials via various directed self-assembly (DSA) schemes has been demonstrated for over a decade. We have previously reported the HONEYCOMB flow; a process flow where we utilize Extreme Ultraviolet Lithography and Oxygen plasma to guide the assembly of cylindrical phase BCPs into regular hexagonal arrays of contact holes [1, 2]. In this work we report the development of a new process flow, the CHIPS flow, where we use ArFi lithography to print guiding patterns for the chemo-epitaxial DSA of BCPs. Using this process flow we demonstrate BCP assembly into hexagonal arrays with sub-25 nm half-pitch and discuss critical steps of the process flow. Additionally, we discuss the influence of under-layer surface energy on the DSA process window and report contact hole metrology results.

Paper Details

Date Published: 20 March 2015
PDF: 7 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250X (20 March 2015); doi: 10.1117/12.2086352
Show Author Affiliations
Arjun Singh, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Boon Teik Chan, IMEC (Belgium)
Doni Parnell, Tokyo Electron Europe Ltd. (Netherlands)
Hengpeng Wu, EMD Performance Materials Corp. (United States)
Jian Yin, EMD Performance Materials Corp. (United States)
Yi Cao, EMD Performance Materials Corp. (United States)
Roel Gronheid, IMEC (Belgium)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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