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Proceedings Paper

Top-coatless 193nm positive-tone development immersion resist for logic application
Author(s): Lian Cong Liu; Tsung Ju Yeh; Yeh-Sheng Lin; Yu Chin Huang; Chien Wen Kuo; Wen Liang Huang; Chia Hung Lin; Chun Chi Yu; Ray Hsu; I-Yuan Wan; Jeff Lin; Kwang-Hwyi Im; Hae Jin Lim; Hyun K. Jeon; Yasuhiro Suzuki; Cheng Bai Xu
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Paper Abstract

In this paper, we summarize our development efforts for a top-coatless 193nm immersion positive tone development (PTD) contact hole (C/H) resist with improved litho and defect performances for logic application specifically with an advance node. The ultimate performance goal was to improve the depth of focus (DoF) margin, mask error enhancement factor (MEEF), critical dimension uniformity (CDU), contact edge roughness (CER), and defect performance. Also, the through pitch CD difference was supposed to be comparable to the previous control resist. Effects of polymer and PAG properties have been evaluated for this purpose. The material properties focused in the evaluation study were polymer activation energy (Ea), polymer solubility differentiated by polymerization process types, and diffusion length (DL) and acidity (pKa) of photoacid generator (PAG). Additionally, the impact of post exposure bake (PEB) temperature was investigated for process condition optimization. As a result of this study, a new resist formulation to satisfy all litho and defect performance was developed and production yield was further improved.

Paper Details

Date Published: 20 March 2015
PDF: 8 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94251T (20 March 2015); doi: 10.1117/12.2086348
Show Author Affiliations
Lian Cong Liu, United Microelectronics Corp. (Taiwan)
Tsung Ju Yeh, United Microelectronics Corp. (Taiwan)
Yeh-Sheng Lin, United Microelectronics Corp. (Taiwan)
Yu Chin Huang, United Microelectronics Corp. (Taiwan)
Chien Wen Kuo, United Microelectronics Corp. (Taiwan)
Wen Liang Huang, United Microelectronics Corp. (Taiwan)
Chia Hung Lin, United Microelectronics Corp. (Taiwan)
Chun Chi Yu, United Microelectronics Corp. (Taiwan)
Ray Hsu, The Dow Chemical Co. (Taiwan)
I-Yuan Wan, The Dow Chemical Co. (Taiwan)
Jeff Lin, The Dow Chemical Co. (Taiwan)
Kwang-Hwyi Im, The Dow Chemical Co. (Korea, Republic of)
Hae Jin Lim, The Dow Chemical Co. (Korea, Republic of)
Hyun K. Jeon, The Dow Chemical Co. (Korea, Republic of)
Yasuhiro Suzuki, The Dow Chemical Co. (Japan)
Cheng Bai Xu, The Dow Chemical Co. (United States)

Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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