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Proceedings Paper

Material readiness for generation 2 directed self-assembly (DSA) < 24nm pitch
Author(s): Eungnak Han; Todd R. Younkin; Manish Chandhok; Alan M. Myers; Tristan A. Tronic; Florian Gstrein; Kranthi Kumar Elineni; Ashish Gaikwad; Paul A. Nyhus; Praveen K. Setu; Charles H. Wallace
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Paper Abstract

The self-assembling behavior of thermally annealed PS-b-PMMA block copolymer derivatives (GEN2 BCPs) was evaluated using a substrate modified by a random copolymer, commonly called a ‘brush’. Similar to PS-b-PMMA, surface modification using the random copolymer brush served as an effective technique for controlling the domain orientation of the GEN2 BCP and yielded aligned features with pitches below 24nm. Non-preferential and weakly preferential random copolymers were also defined and applied to DSA using a graphoepitaxial approach. Finally, a Dry Development Rinse Process (DDRP)[1] was tested as a method to prevent pattern collapse and improve pattern transfer for GEN2 BCPs.

Paper Details

Date Published: 20 March 2015
PDF: 6 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250O (20 March 2015); doi: 10.1117/12.2086094
Show Author Affiliations
Eungnak Han, Intel Corp. (United States)
Todd R. Younkin, Intel Corp. (United States)
Manish Chandhok, Intel Corp. (United States)
Alan M. Myers, Intel Corp. (United States)
Tristan A. Tronic, Intel Corp. (United States)
Florian Gstrein, Intel Corp. (United States)
Kranthi Kumar Elineni, Intel Corp. (United States)
Ashish Gaikwad, Intel Corp. (United States)
Paul A. Nyhus, Intel Corp. (United States)
Praveen K. Setu, Intel Corp. (United States)
Charles H. Wallace, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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