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Proceedings Paper

Impact of sequential infiltration synthesis on pattern fidelity of DSA lines
Author(s): Arjun Singh; Werner Knaepen; Safak Sayan; Ziad el Otell; Boon Teik Chan; Jan Willem Maes; Roel Gronheid
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Paper Abstract

Numerous block copolymer (BCP) systems can be used in directed self-assembly (DSA) processes to form patterns useful in lithography, especially lines and spaces with lamellar phase systems and vias/pillars with cylindrical phase systems. However, most of these BCP systems with attractive pattern formation capabilities have limited plasma etch contrast between the polymer domains. One potential solution to greatly enhance this etch contrast is a recently developed technique called sequential infiltration synthesis (SIS). SIS is a self-limiting synthesis technique, like atomic layer deposition, where organometallic (OM) precursor vapours and oxidants are introduced into self-assembled block copolymer systems in multiple cycles. In the first half of each cycle the OM precursor selectively reacts with one polymer domain, and in the second half of the cycle the oxidant reacts with the OM groups in the polymer film to selectively form metallic compounds in one of the polymer domains. Thus, the polymer pattern is transformed into a metallic mask with much enhanced plasma etch contrast. We report the effects of such a block-selective SIS process of metallic compounds on the feature sizes, roughness and profiles of patterns formed with BCP systems.

Paper Details

Date Published: 20 March 2015
PDF: 7 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250N (20 March 2015); doi: 10.1117/12.2086091
Show Author Affiliations
Arjun Singh, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Werner Knaepen, ASM International N.V. (Belgium)
Safak Sayan, IMEC (Belgium)
Intel Corp. (United States)
Ziad el Otell, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Boon Teik Chan, IMEC (Belgium)
Jan Willem Maes, ASM International N.V. (Netherlands)
Roel Gronheid, IMEC (Belgium)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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