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Proceedings Paper

Rigorous wafer topography simulation for investigating wafer alignment quality and robustness
Author(s): Nicoló Morgana; Dmitrii Gavrilin; Andreas Greiner; Detlef Hofmann; Itaru Kamohara; Ulrich Klostermann; Holger Moeller; Juergen Preuninger
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Paper Abstract

We have been utilizing rigorous simulation software in order to predict the alignment mark signal quality and mark contrast variation induced by processes changes reliably. We have run simulations in order to understand which parameters influence alignment mark quality most and to determine the important parameters that can be manipulated in order to improve it. Simulation of alignment signals (also referred to as waveforms) has been done for resist marks and etched marks, coated and uncoated, as well as in presence of increasing topography complexity. To validate simulation analysis, mark signal collection for different processes (and/or variations of those) and products has been carried out; cross sections have also been generated.

Paper Details

Date Published: 26 March 2015
PDF: 15 pages
Proc. SPIE 9426, Optical Microlithography XXVIII, 94260S (26 March 2015); doi: 10.1117/12.2086075
Show Author Affiliations
Nicoló Morgana, Infineon Technologies Dresden GmbH (Germany)
Dmitrii Gavrilin, Synopsys GmbH (Germany)
Andreas Greiner, Infineon Technologies Dresden GmbH (Germany)
Detlef Hofmann, Infineon Technologies Dresden GmbH (Germany)
Itaru Kamohara, Synopsys GmbH (Germany)
Ulrich Klostermann, Synopsys GmbH (Germany)
Holger Moeller, Infineon Technologies Dresden GmbH (Germany)
Juergen Preuninger, Synopsys GmbH (Germany)

Published in SPIE Proceedings Vol. 9426:
Optical Microlithography XXVIII
Kafai Lai; Andreas Erdmann, Editor(s)

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