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Proceedings Paper

The effects of geometry and chemistry of nanopatterned substrates on the directed self-assembly of block-copolymer melts
Author(s): Grant Garner; Lance Williamson; Robert Seidel; Paulina Rincon Delgadillo; Su-Mi Hur; Roel Gronheid; Paul F. Nealey; Juan J. de Pablo
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Paper Abstract

Directed self-assembly of block copolymers over chemically patterned substrates has proven to be an effective method for sublithographic patterning. Features on these chemical patterns can be multiplied by the natural domain-spacing of the block copolymer assembled on top of the substrate through pattern interpolation. The LiuNealey (LiNe) chemoepitaxy flow for directed self-assembly allows for modification of the geometry and chemistry of the nanopatterned substrate. The critical dimensions and period along with the chemical composition of the patterned features in the LiNe flow govern the equilibrium morphology of the assembled block copolymer. We demonstrate how the construction of the chemical pattern affects the selection for desired, well-registered assembly of block copolymer melts by using a theoretically informed coarse-grained many-body model of block copolymers. The molecular simulations are used to provide an explanation for how to best design the chemical pattern in the LiNe flow for the directed self-assembly (DSA) of block copolymers to achieve desired line-andspace structures.

Paper Details

Date Published: 6 April 2015
PDF: 9 pages
Proc. SPIE 9423, Alternative Lithographic Technologies VII, 94231K (6 April 2015); doi: 10.1117/12.2085987
Show Author Affiliations
Grant Garner, The Univ. of Chicago (United States)
IMEC (Belgium)
Lance Williamson, The Univ. of Chicago (United States)
IMEC (Belgium)
Robert Seidel, The Univ. of Chicago (United States)
IMEC (Belgium)
Paulina Rincon Delgadillo, IMEC (Belgium)
Su-Mi Hur, The Univ. of Chicago (United States)
Roel Gronheid, IMEC (Belgium)
Paul F. Nealey, The Univ. of Chicago (United States)
Juan J. de Pablo, The Univ. of Chicago (United States)

Published in SPIE Proceedings Vol. 9423:
Alternative Lithographic Technologies VII
Douglas J. Resnick; Christopher Bencher, Editor(s)

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