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Proceedings Paper

Ready for multi-beam exposure at 5kV on MAPPER tool: lithographic and process integration performances of advanced resists/stack
Author(s): Isabelle Servin; Ndeye Arame Thiam; Patricia Pimenta-Barros; Marie-Line Pourteau; Armel-Petit Mebiene; Julien Jussot; Jonathan Pradelles; Philippe Essomba; Ludovic Lattard; Pieter Brandt; Marco Wieland
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Paper Abstract

Maskless electron beam lithography is an attractive solution to address sub-90 nm technology nodes with high throughput and manufacturing costs reduction. One of the key challenges is to meet entirely process/integration specifications in terms of resolution, resist sensitivity, roughness and etch transfer into underlayers. In this paper, we evaluate and identify the optimal stack to fit printing performance using e-beam exposures and etch transfer patterning. Besides imaging performance, other key parameters such as outgassing and charge dissipation due to high current density are also considered to fully achieve targets for the machine developed by MAPPER Lithography.

Paper Details

Date Published: 19 March 2015
PDF: 12 pages
Proc. SPIE 9423, Alternative Lithographic Technologies VII, 94231C (19 March 2015); doi: 10.1117/12.2085915
Show Author Affiliations
Isabelle Servin, CEA-LETI (France)
Ndeye Arame Thiam, CEA-LETI (France)
Patricia Pimenta-Barros, CEA-LETI (France)
Marie-Line Pourteau, CEA-LETI (France)
Armel-Petit Mebiene, CEA-LETI (France)
Julien Jussot, CEA-LETI (France)
Jonathan Pradelles, CEA-LETI (France)
Philippe Essomba, CEA-LETI (France)
Ludovic Lattard, CEA-LETI (France)
Pieter Brandt, MAPPER Lithography (Netherlands)
Marco Wieland, MAPPER Lithography (Netherlands)

Published in SPIE Proceedings Vol. 9423:
Alternative Lithographic Technologies VII
Douglas J. Resnick; Christopher Bencher, Editor(s)

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