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Proceedings Paper

Impact of materials selection on graphoepitaxial directed self-assembly for line-space patterning
Author(s): Dung Quach; Valeriy V. Ginzburg; Mingqi Li; Janet Wu; Shih-wei Chang; Peter Trefonas; Phillip D. Hustad; Dan B. Millward; Gurpreet S. Lugani; Scott L. Light
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Paper Abstract

Directed self-assembly (DSA) of block copolymers (BCPs) is a promising technology for advanced patterning at future technology nodes, but significant hurdles remain for commercial implementation. While chemoepitaxy processes employing poly(styrene-block-methyl methacrylate) (PS-PMMA) are most widely studied for DSA line/space patterning, graphoepitaxy processes using more strongly segregated “high-X;” block copolymers have recently shown a lot of promise, with lower defectivity and line-width roughness (LWR) than comparative chemoepitaxy processes. This paper reports on some of the design considerations for optimizing line/space patterning with these materials. We have found that brush and block copolymer selection are critical to achieve high quality DSA. For example, brush thickness must be optimized to achieve matching space critical dimensions, and brush surface energy impacts kinetics of assembly. The X parameter of the block copolymer should be optimized to balance LWR, kinetics of assembly, and process window. Glass transition temperature (Tg) of the blocks showed little impact on performance. Overall, parameters of both BCP and brush must be simultaneously optimized to achieve high quality DSA.

Paper Details

Date Published: 27 March 2015
PDF: 9 pages
Proc. SPIE 9423, Alternative Lithographic Technologies VII, 94230N (27 March 2015); doi: 10.1117/12.2085807
Show Author Affiliations
Dung Quach, Dow Electronic Materials (United States)
Valeriy V. Ginzburg, The Dow Chemical Co. (United States)
Mingqi Li, Dow Electronic Materials (United States)
Janet Wu, Dow Electronic Materials (United States)
Shih-wei Chang, Dow Electronic Materials (United States)
Peter Trefonas, Dow Electronic Materials (United States)
Phillip D. Hustad, Dow Electronic Materials (United States)
Dan B. Millward, Micron Technology, Inc. (United States)
Gurpreet S. Lugani, Micron Technology, Inc. (United States)
Scott L. Light, Micron Technology, Inc. (United States)


Published in SPIE Proceedings Vol. 9423:
Alternative Lithographic Technologies VII
Douglas J. Resnick; Christopher Bencher, Editor(s)

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