Share Email Print
cover

Proceedings Paper

Progresses in 300mm DUV photolithography for the development of advanced silicon photonic devices
Author(s): Charles Baudot; Bertrand Szelag; Nacima Allouti; Corinne Comboroure; Sébastien Bérard-Bergery; Christian Vizioz; Sébastien Barnola; Fabien Gays; Denis Mariolle; Thomas Ferrotti; Aurélie Souhaité; Stéphane Brision; Christophe Kopp; Sylvie Menezo
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper we report on advances in DUV dry photolithography both for etching and implantation of silicon photonic devices. We explain why silicon patterning is a critical building block in silicon photonics and what are the challenges related to that process. Furthermore, it also occurs that some silicon photonic devices need implantation lithographic conditions which are also specific to the technology. For that purpose, we developed a dedicated DUV 193nm implantation lithography to address that need.

Paper Details

Date Published: 18 March 2015
PDF: 12 pages
Proc. SPIE 9426, Optical Microlithography XXVIII, 94260D (18 March 2015); doi: 10.1117/12.2085800
Show Author Affiliations
Charles Baudot, STMicroelectronics (France)
Bertrand Szelag, STMicroelectronics (France)
Nacima Allouti, CEA-LETI (France)
Corinne Comboroure, CEA-LETI (France)
Sébastien Bérard-Bergery, CEA-LETI (France)
Christian Vizioz, CEA-LETI (France)
Sébastien Barnola, CEA-LETI (France)
Fabien Gays, CEA-LETI (France)
Denis Mariolle, CEA-LETI (France)
Thomas Ferrotti, STMicroelectronics (France)
CEA-LETI (France)
Aurélie Souhaité, CEA-LETI (France)
Stéphane Brision, CEA-LETI (France)
Christophe Kopp, CEA-LETI (France)
Sylvie Menezo, CEA-LETI (France)


Published in SPIE Proceedings Vol. 9426:
Optical Microlithography XXVIII
Kafai Lai; Andreas Erdmann, Editor(s)

© SPIE. Terms of Use
Back to Top