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Proceedings Paper

Directly patternable dielectric based on fluorinated polyimide
Author(s): Andrew R. Dick; William K. Bell; Brendan Luke; Erin Maines; Brennan Mueller; Paul A. Kohl; Brandon Rawlings; C. Grant Willson
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Paper Abstract

A photosensitive polyimide system based on amine catalyzed imidization of a precursor poly(amic ester) is described. The material is based on the meta ethyl ester of pyromellitic dianhydride and 2,2’ bis(trifluoromethyl)benzidine and acts as a negative tone resist when formulated with a photobase generator. The material exhibits a dielectric constant of 3.0 in the GHz range, a coefficient of thermal expansion of 6±2 ppm/K, and can be patterned to aspect ratios of greater than 2 when formulated with a high efficiency cinnamide type photobase generator.

Paper Details

Date Published: 20 March 2015
PDF: 8 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94251D (20 March 2015); doi: 10.1117/12.2085793
Show Author Affiliations
Andrew R. Dick, The Univ. of Texas at Austin (United States)
William K. Bell, The Univ. of Texas at Austin (United States)
Brendan Luke, The Univ. of Texas at Austin (United States)
Erin Maines, The Univ. of Texas at Austin (United States)
Brennan Mueller, Georgia Institute of Technology (United States)
Paul A. Kohl, Georgia Institute of Technology (United States)
Brandon Rawlings, Intel Corp. (United States)
C. Grant Willson, The Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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