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Proceedings Paper

Topography aware DFM rule based scoring for silicon yield modeling
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Paper Abstract

DFM rule based scoring is associated with manufacturability rules checking and applying the scoring to predict the yield entitlement for an IC chip design. Achieving high DFM score is one of the key requirements to get high yield. The DFM scoring methodology is currently limited to DFM recommend rules and their associated failure rates. In contrast to failure mechanism, chemical-mechanical polishing (CMP) step topography variations places an important role to it. In this paper, we present an advanced DFM analysis flow to compute DFM score that incorporate topography variation along with recommend rule scoring using complex scoring model to increase silicon yield correlation.

Paper Details

Date Published: 18 March 2015
PDF: 7 pages
Proc. SPIE 9427, Design-Process-Technology Co-optimization for Manufacturability IX, 94270V (18 March 2015); doi: 10.1117/12.2085733
Show Author Affiliations
Vikas Tripathi, GLOBALFOUNDRIES, Inc. (Singapore)
Ushasree Katakamsetty, GLOBALFOUNDRIES Singapore (Singapore)
Sky Yeo, GLOBALFOUNDRIES, Inc. (Singapore)
Colin Hui, GLOBALFOUNDRIES, Inc. (Singapore)

Published in SPIE Proceedings Vol. 9427:
Design-Process-Technology Co-optimization for Manufacturability IX
John L. Sturtevant; Luigi Capodieci, Editor(s)

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