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Proceedings Paper

Collaborative work on reducing the intersite gaps in outgassing qualification
Author(s): Soichi Inoue; Eishi Shiobara; Takeshi Sasami; Isamu Takagi; Yukiko Kikuchi; Toru Fujimori; Shinya Minegishi; Robert Berg; Thomas Lucatorto; Shannon Hill; Charles Tarrio; Ivan Pollentier; Yen-Chih Lin; Yu-Jen Fan; Dominic Ashworth
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Paper Abstract

This paper reports on an all-out effort to reduce the intersite gap of the resist outgassing contamination growth in the results obtained under the round-robin scheme. All test sites collaborated to determine the causes of such gaps. First, it was determined that wafer temperature during exposure could impact the amount of contamination growth. We discovered a huge intersite gap of wafer temperatures among the sites by using a wafer-shaped remote thermometer with wireless transmitting capability. Second, whether the contamination-limited regime was attained during testing could have been another primary root cause for such a difference. We found that for one of the model resists whose protecting unit had lower activation energy and molecular weight the contamination-limited regime was insufficient at one test site. Third, the ratio of the exposed area to pumping speed is necessary to equalize contamination growth. We validated the effect of matching the ratio of exposure area to pumping speed on reducing the intersite gap. This study and the protocols put in place should reduce the intersite gap dramatically.

Paper Details

Date Published: 13 March 2015
PDF: 10 pages
Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 942212 (13 March 2015); doi: 10.1117/12.2085700
Show Author Affiliations
Soichi Inoue, EUVL Infrastructure Development Ctr., Inc. (Japan)
Eishi Shiobara, EUVL Infrastructure Development Ctr., Inc. (Japan)
Takeshi Sasami, EUVL Infrastructure Development Ctr., Inc. (Japan)
Isamu Takagi, EUVL Infrastructure Development Ctr., Inc. (Japan)
Yukiko Kikuchi, EUVL Infrastructure Development Ctr., Inc. (Japan)
Toru Fujimori, EUVL Infrastructure Development Ctr., Inc. (Japan)
Shinya Minegishi, EUVL Infrastructure Development Ctr., Inc. (Japan)
Robert Berg, National Institute of Standards and Technology (United States)
Thomas Lucatorto, National Institute of Standards and Technology (United States)
Shannon Hill, National Institute of Standards and Technology (United States)
Charles Tarrio, National Institute of Standards and Technology (United States)
Ivan Pollentier, IMEC (Belgium)
Yen-Chih Lin, IMEC (Belgium)
Yu-Jen Fan, SEMATECH Inc. (United States)
Dominic Ashworth, SEMATECH Inc. (United States)


Published in SPIE Proceedings Vol. 9422:
Extreme Ultraviolet (EUV) Lithography VI
Obert R. Wood; Eric M. Panning, Editor(s)

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