Share Email Print

Proceedings Paper

Study of EUVL patterned mask inspection tool for half-pitch (hp) 16nm-11nm node
Author(s): Ryoichi Hirano; Susumu Iida; Tsuyoshi Amano; Hidehiro Watanabe; Masahiro Hatakeyama; Takeshi Murakami; Shoji Yoshikawa; Kenichi Karimata; Kenji Terao
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

EUVL patterned mask defect detection is one of the major issues to realize device fabrication with EUV lithography.1-6 We have already designed a novel Projection Electron Microscope (PEM) optics that has been integrated into a new inspection system named EBEYE-V30 (“Model EBEYE” is an EBARA’s model code), and which seems to be quite promising for hp 16 nm node EUVL patterned mask inspection. The PEM system performs well for hp 16 nm EUVL patterned mask inspection. Moreover, we discuss the system extendibility to 11 nm node defect detection. High-speed image sensor, high-speed image processing circuit, and bright/stable electron source are necessary for hp 11 nm defect inspection. We describe the experimental results of the EUVL patterned mask inspection using the abovementioned system for hp 11 nm node. Programmed defects in hp 11 nm (44 nm on mask) are applied for defect detection sensitivity evaluation.

Paper Details

Date Published: 13 March 2015
PDF: 9 pages
Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 942224 (13 March 2015); doi: 10.1117/12.2085694
Show Author Affiliations
Ryoichi Hirano, EUVL Infrastructure Development Ctr., Inc. (Japan)
Susumu Iida, EUVL Infrastructure Development Ctr., Inc. (Japan)
Tsuyoshi Amano, EUVL Infrastructure Development Ctr., Inc. (Japan)
Hidehiro Watanabe, EUVL Infrastructure Development Ctr., Inc. (Japan)
Masahiro Hatakeyama, EBARA Corp. (Japan)
Takeshi Murakami, EBARA Corp. (Japan)
Shoji Yoshikawa, EBARA Corp. (Japan)
Kenichi Karimata, EBARA Corp. (Japan)
Kenji Terao, EBARA Corp. (Japan)

Published in SPIE Proceedings Vol. 9422:
Extreme Ultraviolet (EUV) Lithography VI
Obert R. Wood; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top