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Proceedings Paper

Holistic approach using accuracy of diffraction-based integrated metrology to improve on-product performance, reduce cycle time, and cost at litho
Author(s): Kaustuve Bhattacharyya; Arie den Boef; Martin Jak; Gary Zhang; Martijn Maassen; Robin Tijssen; Omer Adam; Andreas Fuchs; Youping Zhang; Jacky Huang; Vincent Couraudon; Wilson Tzeng; Eason Su; Cathy Wang; Jim Kavanagh; Christophe Fouquet
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Paper Abstract

High-end semiconductor lithography requirements for CD, focus and overlay control drive the need for diffraction-based metrology1,2,3,4 and integrated metrology5. In the advanced nodes, more complex lithography techniques (such as multiple patterning), use of multi-layer overlay measurements in process control, advanced device designs (such as advanced FinFET), as well as advanced materials (like hardmasks) are introduced. These pose new challenges for lithometro cycle time, cost, process control and metrology accuracy. In this publication a holistic approach is taken to face these challenges via a novel target design, a brand new implementation of multi-layer overlay measurement capability in diffraction-based mode and integrated metrology.

Paper Details

Date Published: 19 March 2015
PDF: 8 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241E (19 March 2015); doi: 10.1117/12.2085678
Show Author Affiliations
Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Arie den Boef, ASML Netherlands B.V. (Netherlands)
Martin Jak, ASML Netherlands B.V. (Netherlands)
Gary Zhang, ASML Netherlands B.V. (United States)
Martijn Maassen, ASML Netherlands B.V. (Netherlands)
Robin Tijssen, ASML Netherlands B.V. (Netherlands)
Omer Adam, ASML Netherlands B.V. (Netherlands)
Andreas Fuchs, ASML Netherlands B.V. (Netherlands)
Youping Zhang, ASML Netherlands B.V. (United States)
Jacky Huang, ASML Netherlands B.V. (Netherlands)
Vincent Couraudon, ASML Netherlands B.V. (Taiwan)
Wilson Tzeng, ASML Netherlands B.V. (Taiwan)
Eason Su, ASML Netherlands B.V. (Netherlands)
Cathy Wang, ASML Netherlands B.V. (Taiwan)
Jim Kavanagh, ASML Netherlands B.V. (Netherlands)
Christophe Fouquet, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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