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Proceedings Paper

Organic hard masks utilizing fullerene derivatives
Author(s): Andreas Frommhold; Alan G. Brown; Richard E. Palmer; Tom Lada; Alex P. Robinson
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Paper Abstract

We have developed a series of fullerene containing materials for use as organic hard masks. Films with a thickness of up to 250 nm were deposited via spin coating. After a crosslinking bake the films exhibit good thermal stability – in the best case a mass loss of less than 3% at 400 °C is seen. Etch resistance of the different formulations are presented and hig-hresolution patterning is demonstrated. During the transfer into silicon no adverse “wiggling” is observed at high resolution. We attribute this to the low levels of aliphatic hydrogen present in the materials.

Paper Details

Date Published: 20 March 2015
PDF: 8 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250L (20 March 2015); doi: 10.1117/12.2085675
Show Author Affiliations
Andreas Frommhold, The Univ. of Birmingham (United Kingdom)
Alan G. Brown, Irresistible Materials Ltd. (United Kingdom)
Richard E. Palmer, The Univ. of Birmingham (United Kingdom)
Tom Lada, Nano-C, Inc. (United States)
Alex P. Robinson, The Univ. of Birmingham (United Kingdom)

Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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