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Proceedings Paper

Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing
Author(s): S. J. Ben Yoo
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Paper Abstract

This paper discusses heterogeneous 2D and 3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems information processing capabilities in the temporal, spectral, and spatial domains. Future prospects and challenges in computing and networking applications will also be discussed.

Paper Details

Date Published: 27 February 2015
PDF: 10 pages
Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660B (27 February 2015); doi: 10.1117/12.2085593
Show Author Affiliations
S. J. Ben Yoo, Univ. of California, Davis (United States)

Published in SPIE Proceedings Vol. 9366:
Smart Photonic and Optoelectronic Integrated Circuits XVII
Louay A. Eldada; El-Hang Lee; Sailing He, Editor(s)

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