Share Email Print

Proceedings Paper

Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing
Author(s): S. J. Ben Yoo
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper discusses heterogeneous 2D and 3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems information processing capabilities in the temporal, spectral, and spatial domains. Future prospects and challenges in computing and networking applications will also be discussed.

Paper Details

Date Published: 27 February 2015
PDF: 10 pages
Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660B (27 February 2015); doi: 10.1117/12.2085593
Show Author Affiliations
S. J. Ben Yoo, Univ. of California, Davis (United States)

Published in SPIE Proceedings Vol. 9366:
Smart Photonic and Optoelectronic Integrated Circuits XVII
Louay A. Eldada; El-Hang Lee; Sailing He, Editor(s)

© SPIE. Terms of Use
Back to Top