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Proceedings Paper

Fundamental study of spin-coating using in-situ analysis and simulation
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Paper Abstract

Spin coating has been used as a photoresist application method for many years, and consequently certain defects have been recognized through each resist generation; i-line, KrF, ArF, ArF immersion and, most recently, EUV. Last year we reported an in-situ analysis via high-speed video camera that proved to be useful for understanding defect formation such as non-uniformity spots within organic film coatings and post-develop water-mark defects. In this study, fingerprints known as ‘tiger stripes’ around the wafer’s edge were analyzed. This phenomenon, for example, is directly related to the wafer spin-speed and air-flow during the coat-processing. Utilizing a high-speed camera and 3D simulation, we reveal the mechanism of fingerprint generation for tiger stripe phenomena, confirm the mechanism with several different spin-speeds, and correlate these to defect inspection results. Furthermore, we will discuss the expansion to 450mmm wafers.

Paper Details

Date Published: 20 March 2015
PDF: 8 pages
Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250G (20 March 2015); doi: 10.1117/12.2085277
Show Author Affiliations
Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Jun-ichi Yoshida, SCREEN Holdings Co., Ltd. (Japan)
Harold Stokes, Dainippon Screen Deutschland GmbH (Germany)
Yuji Tanaka, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Tadashi Miyagi, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Koji Kaneyama, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Charles Pieczulewski, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 9425:
Advances in Patterning Materials and Processes XXXII
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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