Share Email Print

Proceedings Paper

Improving process and system for EUV coat-develop track
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

EUV lithography (EUVL) is well known to be a strong candidate for next generation, single exposure sub-30nm half-pitch lithography.[1] Furthermore, a high-NA EUV exposure tool released two years ago gave a strong impression for finer pattern results. On one hand, it seems that the coat develop track process remains very similar and in many aspects returns to KrF or ArF dry process fundamentals, but in practice the 26-32nm pitch patterning coat-develop track process also has challenges with EUV resist. As access to EUV lithography exposures has become more readily available over the last five (5) years, several challenges and accomplishments in the track process have been reported, such as the improvement of ultra-thin film coating, CD uniformity, defectivity, line width roughness (LWR) and so on.[2-6] The coat-develop track process has evolved along with novel materials and metrology capability improvements. Line width roughness (LWR) and defect control are demonstrated utilizing the SOKUDO DUO coat-develop track system with an ASML NXE:3100 in the IMEC (Leuven, Belgium) clean room environment. Additionally, we will show the latest lithographic results obtained by novel processing approaches in an EUV coat-develop track system.

Paper Details

Date Published: 19 March 2015
PDF: 8 pages
Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 94222C (19 March 2015); doi: 10.1117/12.2085275
Show Author Affiliations
Masahiko Harumoto, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Harold Stokes, Dainippon Screen Deutschland GmbH (Germany)
Yan Thouroude, Dainippon Screen Deutschland GmbH (Germany)
Tadashi Miyagi, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Koji Kaneyama, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Charles Pieczulewski, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Masaya Asai, Dainippon Screen Manufacturing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 9422:
Extreme Ultraviolet (EUV) Lithography VI
Obert R. Wood; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top