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Proceedings Paper

Hybrid silicon unidirectional-emission microspiral disk lasers for optical interconnect applications
Author(s): Andrew W. Poon; Yu Zhang; Lei Zhang
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Paper Abstract

In this paper, we report our recent progress on hybrid silicon uniport-waveguide-emission microspiral disk lasers for optical interconnects using bisbenzocyclobutene (BCB) die-to-die bonding. We numerically and experimentally investigate different silicon microspiral disk cavities directly coupled with an output-waveguide, with III-V multiple-quantum-well (MQW) gain mediums of different circular microdisk geometries vertically coupled on the top via a sub- 100nm BCB layer, and ring-shaped injection electrodes along the rim of the hybrid integrated structure in order to enhance the spatial overlap between the injection current distribution in the III-V gain microdisk and the whispering-gallery-like mode field in the hybrid silicon microcavity. We design and experimentally investigate an integrated thermal shunt connecting a 90o-arc of the III-V gain microdisk to the silicon substrate underneath in order to lower the thermal resistance of the lasers. We observe transverse-electric (TE)-polarized mode dominated multimode lasing emission out-coupled from the silicon waveguide of the hybrid silicon lasers under a pulsed injection at room temperature, with a threshold current of 30 mA and a side-mode-suppression-ratio (SMSR) of 25 dB at 50 mA.

Paper Details

Date Published: 3 March 2015
PDF: 12 pages
Proc. SPIE 9343, Laser Resonators, Microresonators, and Beam Control XVII, 934312 (3 March 2015); doi: 10.1117/12.2084810
Show Author Affiliations
Andrew W. Poon, Hong Kong Univ. of Science and Technology (Hong Kong, China)
Yu Zhang, Hong Kong Univ. of Science and Technology (Hong Kong, China)
Lei Zhang, Hong Kong Univ. of Science and Technology (Hong Kong, China)
Institute of Semiconductors (China)


Published in SPIE Proceedings Vol. 9343:
Laser Resonators, Microresonators, and Beam Control XVII
Alexis V. Kudryashov; Alan H. Paxton; Vladimir S. Ilchenko; Lutz Aschke; Kunihiko Washio, Editor(s)

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