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Proceedings Paper

Measurement of thin film adhesion by single cantilever beam method equipped with adjustable jig
Author(s): Dong-Kil Shin; Jung-Ju Lee; Jai-Sug Hawong
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Paper Abstract

A new method to measure the tensile adhesion of thin film was proposed. A single cantilever beam method was used and an efficient adjustable jig was designed to minimize errors induced by misalignment of specimen. Applied load and displacement were recorded by data acquisition system. The dimensions of the specimen and conditions of test were preexamined by finite element analysis. Developed method was applied to measure the adhesion of thin film adhesive. Test results were independent of initial deviation of specimen alignment and showed consistent value with respect to crack length. Compared with shear test method, it was shown that the shear adhesion included the effect of thickness of adhesive, however, tensile adhesion was independent of the thickness of adhesive.

Paper Details

Date Published: 4 March 2015
PDF: 4 pages
Proc. SPIE 9302, International Conference on Experimental Mechanics 2014, 930237 (4 March 2015); doi: 10.1117/12.2084779
Show Author Affiliations
Dong-Kil Shin, Yeungnam Univ. (Korea, Republic of)
Jung-Ju Lee, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Jai-Sug Hawong, Yeungnam Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9302:
International Conference on Experimental Mechanics 2014
Chenggen Quan; Kemao Qian; Anand Asundi; Fook Siong Chau, Editor(s)

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