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Proceedings Paper

RF to millimeter wave integration and module technologies
Author(s): T. Vähä-Heikkilä
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Paper Abstract

Radio Frequency (RF) consumer applications have boosted silicon integrated circuits (IC) and corresponding technologies. More and more functions are integrated to ICs and their performance is also increasing. However, RF front-end modules with filters and switches as well as antennas still need other way of integration. This paper focuses to RF front-end module and antenna developments as well as to the integration of millimeter wave radios. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for RF and millimeter wave integrated modules. In addition to in-house technologies, VTT is using module and component technologies from other commercial sources.

Paper Details

Date Published: 3 April 2015
PDF: 8 pages
Proc. SPIE 9434, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2015, 94340S (3 April 2015); doi: 10.1117/12.2084187
Show Author Affiliations
T. Vähä-Heikkilä, VTT Technical Research Ctr. of Finland (Finland)


Published in SPIE Proceedings Vol. 9434:
Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2015
Vijay K. Varadan, Editor(s)

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