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Proceedings Paper

Strain and voltage analysis of a piezoelectric wafer bonded to thin plate in bending
Author(s): ZhongZhe Dong; Cassio T. Faria
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Proc. SPIE 9432, Behavior and Mechanics of Multifunctional Materials and Composites 2015, 94320A; doi: 10.1117/12.2084177
Show Author Affiliations
ZhongZhe Dong, Siemens Industry Software (Belgium)
Cassio T. Faria, Siemens Industry Software (Belgium)


Published in SPIE Proceedings Vol. 9432:
Behavior and Mechanics of Multifunctional Materials and Composites 2015
Nakhiah C. Goulbourne, Editor(s)

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