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Proceedings Paper

On the repeatability of the EMI for the monitoring of bonded joints
Author(s): Vincenzo Gulizzi; Piervincenzo Rizzo; Alberto Milazzo
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Paper Abstract

We study the feasibility and the repeatability of the electromechanical impedance (EMI) method for the health monitoring of lightweight bonded joints. The EMI technique exploits the coupling between the displacement field and the potential field of a piezoelectric material, by attaching or embedding a piezoelectric transducer to the structure to be monitored. The sensor is excited by an external voltage and the electrical admittance which is the ratio between the electric current and the applied voltage is measured as it depends on the mechanical coupling between the transducer and the host structure. Owing to this interaction, the admittance may represent a signature for the health of the host structure. In this study the EMI method is applied to aluminum joints adhesively bonded. We investigate the repeatability of the proposed method by monitoring the same aluminum components bonded many times using the same adhesive mix, and then by monitoring the same two components bonded several times by means of different adhesive qualities. The results demonstrate that the EMI is repeatable and variations in the admittance signatures are related to the quality (health) of the bond.

Paper Details

Date Published: 23 March 2015
PDF: 10 pages
Proc. SPIE 9438, Health Monitoring of Structural and Biological Systems 2015, 943827 (23 March 2015); doi: 10.1117/12.2084023
Show Author Affiliations
Vincenzo Gulizzi, Univ. of Palermo (Italy)
Univ. of Pittsburgh (United States)
Piervincenzo Rizzo, Univ. of Pittsburgh (United States)
Alberto Milazzo, Univ. of Palermo (Italy)

Published in SPIE Proceedings Vol. 9438:
Health Monitoring of Structural and Biological Systems 2015
Tribikram Kundu, Editor(s)

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