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Proceedings Paper

Multilayer based lab-on-a-chip-systems for substance testing
Author(s): Frank Sonntag; Stefan Grünzner; Florian Schmieder; Mathias Busek; Udo Klotzbach; Volker Franke
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Paper Abstract

An integrated technology chain for laser-microstructuring and bonding of polymer foils for fast, flexible and low-cost manufacturing of multilayer lab-on-a-chip devices especially for complex cell and tissue culture applications, which provides pulsatile fluid flow within physiological ranges at low media-to-cells ratio, was developed and established. Initially the microfluidic system is constructively divided into individual layers which are formed by separate foils or plates. Based on the functional boundary conditions and the necessary properties of each layer the corresponding foils and plates are chosen. In the third step the foils and plates are laser microstructured and functionalized from both sides. In the fourth and last manufacturing step the multiple plates and foils are joined using thermal diffusion bonding. Membranes for pneumatically driven valves and micropumps where bonded via chemical surface modification. Based on the established lab-on-a-chip platform for perfused cell-based assays, a multilayer microfluidic system with two parallel connected cell culture chambers was successfully implemented.

Paper Details

Date Published: 12 March 2015
PDF: 10 pages
Proc. SPIE 9351, Laser-based Micro- and Nanoprocessing IX, 93510C (12 March 2015); doi: 10.1117/12.2083100
Show Author Affiliations
Frank Sonntag, Fraunhofer Institute for Material and Beam Technology, IWS (Germany)
Stefan Grünzner, Fraunhofer IWS Dresden (Germany)
Florian Schmieder, Fraunhofer Institute for Material and Beam Technology, IWS (Germany)
Mathias Busek, Fraunhofer Institute for Material and Beam Technology, IWS (Germany)
Udo Klotzbach, Fraunhofer Institute for Material and Beam Technology, IWS (Germany)
Volker Franke, Fraunhofer IWS Dresden (Germany)


Published in SPIE Proceedings Vol. 9351:
Laser-based Micro- and Nanoprocessing IX
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)

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