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Proceedings Paper

Effects of packaging on the performances of high brightness 9xx nm CW mini-bar diode lasers
Author(s): Xiaoning Li; Jingwei Wang; Feifei Feng; Yalong Liu; Dongshan Yu; Pu Zhang; Xingsheng Liu
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Paper Abstract

9xx nm CW mini-bar diode lasers and stacks with high brightness and reliability are desired for pumping fiber lasers and direct fiber coupling applications. For the traditional cm-bar with 1mm-2mm cavity, it can provide CW output power up to 80W-100W and high reliability, whereas the brightness is relatively low. In comparison, mini-bar based diode lasers with 4mm cavity offer a superior performance balance between power, brightness, and reliability. However, the long cavity and large footprint of mini-bar diode laser renders its sensitivity towards thermal stress formed in packaging process, which directly affects the performances of high bright mini-bar diode lasers. In this work, the thermal stress correlating with package structure and packaging process are compared and analyzed. Based on the experiment and analysis results, an optimized package structure of CW 60W 976 nm mini-bar diode lasers is designed and developed which relieves thermal stress.

Paper Details

Date Published: 20 February 2015
PDF: 8 pages
Proc. SPIE 9346, Components and Packaging for Laser Systems, 93460C (20 February 2015); doi: 10.1117/12.2080480
Show Author Affiliations
Xiaoning Li, Xi'an Institute of Optics and Precision Mechanics (China)
Focuslight Technologies Co., Ltd. (China)
Xi'an Jioatong Univ. (China)
Jingwei Wang, Focuslight Technologies Co., Ltd. (China)
Feifei Feng, Xi'an Institute of Optics and Precision Mechanics (China)
Yalong Liu, Focuslight Technologies Co., Ltd. (China)
Dongshan Yu, Focuslight Technologies Co., Ltd. (China)
Pu Zhang, Xi'an Institute of Optics and Precision Mechanics (China)
Xingsheng Liu, Xi'an Institute of Optics and Precision Mechanics (China)
Focuslight Technologies Co., Ltd. (China)


Published in SPIE Proceedings Vol. 9346:
Components and Packaging for Laser Systems
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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