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Proceedings Paper

Photodiodes integration on a suspended ridge structure VOA using 2-step flip-chip bonding method
Author(s): Seon Hoon Kim; Tae Un Kim; Hyun Chul Ki; Doo Gun Kim; Hwe Jong Kim; Jung Woon Lim; Dong Yeol Lee; Chul Hee Park
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Paper Abstract

In this works, we have demonstrated a VOA integrated with mPDs, based on silica-on-silicon PLC and flip-chip bonding technologies. The suspended ridge structure was applied to reduce the power consumption. It achieves the attenuation of 30dB in open loop operation with the power consumption of below 30W. We have applied two-step flipchip bonding method using passive alignment to perform high density multi-chip integration on a VOA with eutectic AuSn solder bumps. The average bonding strength of the two-step flip-chip bonding method was about 90gf.

Paper Details

Date Published: 7 February 2015
PDF: 6 pages
Proc. SPIE 9389, Next-Generation Optical Communication: Components, Sub-Systems, and Systems IV, 93890S (7 February 2015); doi: 10.1117/12.2080463
Show Author Affiliations
Seon Hoon Kim, Korea Photonics Technology Institute (Korea, Republic of)
Tae Un Kim, Korea Photonics Technology Institute (Korea, Republic of)
Hyun Chul Ki, Korea Photonics Technology Institute (Korea, Republic of)
Doo Gun Kim, Korea Photonics Technology Institute (Korea, Republic of)
Hwe Jong Kim, Korea Photonics Technology Institute (Korea, Republic of)
Jung Woon Lim, Korea Photonics Technology Institute (Korea, Republic of)
Dong Yeol Lee, Korea Photonics Technology Institute (Korea, Republic of)
Chul Hee Park, Wooriro Optical Telecom Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9389:
Next-Generation Optical Communication: Components, Sub-Systems, and Systems IV
Guifang Li; Xiang Zhou, Editor(s)

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