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Proceedings Paper

Trans-wafer removal of metallization using a nanosecond Tm:fiber laser
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Paper Abstract

By utilizing photon energies considerably smaller than the semiconductors’ energy band gap, space-selective modifications can be induced in semiconductors beyond the laser-incident surface. Previously, we demonstrated that back surface modifications could be produced in 500-600 μm thin Si and GaAs wafers independently without affecting the front surface. In this paper, we present our latest studies on trans-wafer processing of semiconductors using a self-developed nanosecond-pulsed thulium fiber laser operating at the wavelength 2 μm. A qualitative study of underlying physical mechanisms responsible for material modification was performed. We explored experimental conditions that will enable many potential applications such as trans-wafer metallization removal for PV cell edge isolation, selective surface annealing and wafer scribing. These processes were investigated by studying the influence of process parameters on the resulting surface morphology, microstructure and electric properties.

Paper Details

Date Published: 4 March 2015
PDF: 8 pages
Proc. SPIE 9350, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XX, 93500B (4 March 2015); doi: 10.1117/12.2079982
Show Author Affiliations
Ilya Mingareev, CREOL, Univ. of Central Florida (United States)
Fraunhofer Institute for Laser Technology (Germany)
Sascha Berger, CREOL, Univ. of Central Florida (United States)
Fraunhofer Institute for Laser Technology (Germany)
Thomas Tetz, CREOL, Univ. of Central Florida (United States)
Fraunhofer Institute for Laser Technology (Germany)
Ali Abdulfattah, CREOL, Univ. of Central Florida (United States)
Alex M. Sincore, The College of Optics and Photonics, Univ. of Central Florida (United States)
Lawrence Shah, CREOL, Univ. of Central Florida (United States)
Martin C. Richardson, CREOL, Univ. of Central Florida (United States)


Published in SPIE Proceedings Vol. 9350:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XX
Stephan Roth; Yoshiki Nakata; Beat Neuenschwander; Xianfan Xu, Editor(s)

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