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Proceedings Paper

Design and fabrication of 3D high-contrast metastructure THz cage waveguides
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Paper Abstract

We have designed new THz metastructure waveguides on Si wafers, aimed for low propagation loss and integration with Si-based integrated circuits. The waveguide has a round cross-sectional hollow-core, surrounded by high reflectioncladding- walls formed by high-contrast metastructure gratings. We developed a new fabrication technique to fabricate such a 3D metastructure cage waveguide structure. The waveguide is built using the entire wafer thickness which involves deep Si etching of periodically spaced holes and using isotropic undercut etching to create a connecting a line of etched spheres in the middle of the wafer to form the waveguide’s hollow core, then deep etch the high-contrast grating through the entire wafer thickness to form the cladding for the waveguide. We have successfully modeled and fabricated such a waveguide structure. The next step is to experimentally test and characterize the waveguide in the THz spectrum range.

Paper Details

Date Published: 27 February 2015
PDF: 8 pages
Proc. SPIE 9372, High Contrast Metastructures IV, 93720J (27 February 2015); doi: 10.1117/12.2079720
Show Author Affiliations
Gerard Dang, U.S. Army Research Lab. (United States)
Monica Taysing-Lara, U.S. Army Research Lab. (United States)
Weimin Zhou, U.S. Army Research Lab. (United States)
Tianbo Sun, Univ. of California, Berkeley (United States)
Weijan Yang, Univ. of California, Berkeley (United States)
Connie J. Chang-Hasnain, Univ. of California, Berkeley (United States)


Published in SPIE Proceedings Vol. 9372:
High Contrast Metastructures IV
Connie J. Chang-Hasnain; David Fattal; Fumio Koyama; Weimin Zhou, Editor(s)

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