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Proceedings Paper

Multi-wavelength transceiver integration on SOI for high-performance computing system applications
Author(s): Timo Aalto; Mikko Harjanne; Sami Ylinen; Markku Kapulainen; Tapani Vehmas; Matteo Cherchi; Christian Neumeyr; Markus Ortsiefer; Antonio Malacarne
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Paper Abstract

We present a vision for transceiver integration on a 3 μm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 μm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 μm thick SOI waveguides locally tapered down to 3 μm to provide low-loss coupling between an optical single-mode fiber array and the 3 μm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 μm.

Paper Details

Date Published: 3 April 2015
PDF: 10 pages
Proc. SPIE 9368, Optical Interconnects XV, 93680B (3 April 2015); doi: 10.1117/12.2079682
Show Author Affiliations
Timo Aalto, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Mikko Harjanne, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Sami Ylinen, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Markku Kapulainen, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Tapani Vehmas, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Matteo Cherchi, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Christian Neumeyr, VERTILAS GmbH (Germany)
Markus Ortsiefer, VERTILAS GmbH (Germany)
Antonio Malacarne, Consorzio Nazionale Interuniversitario per le Telecomunicazioni (Italy)


Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)

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