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Proceedings Paper

High power diode laser stack development using gold-tin bonding technology
Author(s): Dong Hou; Jingwei Wang; Pu Zhang; Lei Cai; Ye Dai; Yingjie Li; Xingsheng Liu
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Paper Abstract

High power diode lasers have increased application in many fields. In this work, a sophisticated high power and high performance conduction cooled diode laser stack has been developed for long pulse duration and high duty cycle using gold-tin (AuSn) bonding technology. The transient thermal behavior and optical simulation of the laser diode stack module are investigated to optimize the laser device structure. CTE-matched submount and AuSn hard solder are used for bonding the laser diode bar to achieve higher reliability and longer lifetime. Guided by the numerical simulation and analytical results, conduction cooled diode laser stack with high power, long pulse duration and high duty cycle is fabricated and characterized. Compared with the conventional indium bonding technology, the new design is a promising approach to obtain improved performance with high reliability and long lifetime.

Paper Details

Date Published: 20 February 2015
PDF: 9 pages
Proc. SPIE 9346, Components and Packaging for Laser Systems, 934604 (20 February 2015); doi: 10.1117/12.2079610
Show Author Affiliations
Dong Hou, Focuslight Technologies Co., Ltd. (China)
Jingwei Wang, Focuslight Technologies Co., Ltd. (China)
Pu Zhang, Xi'an Institute of Optics and Precision Mechanics (China)
Lei Cai, Focuslight Technologies Co., Ltd. (China)
Ye Dai, Focuslight Technologies Co., Ltd. (China)
Yingjie Li, Focuslight Technologies Co., Ltd. (China)
Xingsheng Liu, Focuslight Technologies Co., Ltd. (China)
Xi'an Institute of Optics and Precision Mechanics (China)


Published in SPIE Proceedings Vol. 9346:
Components and Packaging for Laser Systems
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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