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Proceedings Paper

Correlation of electrical and structural microanalysis of dendritic web silicon
Author(s): Kuntal Joardar; Chan Ouk Jung; Stephen J. Krause; Dieter K. Schroder; Daniel L. Meier
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Paper Abstract

To correlate microscopic with macroscopic properties and to investigate minority carrier recombination at the twins planes in dendritic web Si on a microscopic scale, cross-sectional EBIC has been developed. The twin planes are found to be transparent to minority carriers In as-grown material Irrespective of its quality. Upon cell processing, however, it is found that the twin planes in poor quality material become highly recombinative while recombination at regions close to the surface decreases. In good quality web material the twin planes remain benign after thermal cycling. DLTS measurements have also been performed and the results are consistent with EBIC. Crosssectional TEM results also correlate with the electrical measurements showing the appearance of a large density of defect clusters at the twin planes of the poor quality web upon thermal processing.

Paper Details

Date Published: 1 October 1990
PDF: 12 pages
Proc. SPIE 1284, Nanostructure and Microstructure Correlation with Physical Properties of Semiconductors, (1 October 1990); doi: 10.1117/12.20796
Show Author Affiliations
Kuntal Joardar, Motorola, Inc. (United States)
Chan Ouk Jung, Arizona State Univ. (United States)
Stephen J. Krause, Arizona State Univ. (United States)
Dieter K. Schroder, Arizona State Univ. (United States)
Daniel L. Meier, Westinghouse R&D Ctr. (United States)


Published in SPIE Proceedings Vol. 1284:
Nanostructure and Microstructure Correlation with Physical Properties of Semiconductors
Harold G. Craighead; J. Murray Gibson, Editor(s)

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