Share Email Print
cover

Proceedings Paper

Strategies for precision adhesive bonding of micro-optical systems
Author(s): Tobias Müller; Vyshak Kotnur Venu; Sebastian Haag; Daniel Zontar; Sebastian Sauer; Christian Wenzel; Christian Brecher
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Today’s piezo-based micromanipulator technology allows for highly precise manipulation of optical components. A crucial question for the quality of optical assemblies is the misalignment after curing. The challenge of statistical deviations in the curing process requires a sophisticated knowledge on the relevant process parameters. An approach to meet these requirements is the empirical analysis such as characterization of shrinkage. Gaining sophisticated knowledge about the statistical process of adhesive bonding advances the quality of related production steps like beam-shaping optics, mounting of turning mirrors for fiber coupling or building resonators evaluating power, mode characteristics and beam shape. Maximizing the precision of these single assembly steps fosters the scope of improving the overall efficiency of the entire laser system. At Fraunhofer IPT research activities on the identification of relevant parameters for improved adhesive bonding precision have been undertaken and are ongoing. The influence of the volumetric repeatability of different automatic and manual dispensing methods play an important role. Also, the evaluation of UV-light sources and the relating illumination properties have a significant influence on the bonding result. Furthermore, common UV-curing adhesives are being examined on their performance and reliability for both highest precision prototyping, as well as their application as robust bonding medium in automated optics assembly cells. This paper sums up the parameters of most influence. Overall goal of these activities is the development of a prediction model for optimized shrinkage compensation and thus improved assembly quality.

Paper Details

Date Published: 1 April 2015
PDF: 8 pages
Proc. SPIE 9346, Components and Packaging for Laser Systems, 93460E (1 April 2015); doi: 10.1117/12.2079149
Show Author Affiliations
Tobias Müller, Fraunhofer-Institut für Produktionstechnologie (Germany)
Vyshak Kotnur Venu, Fraunhofer-Institut für Produktionstechnologie (Germany)
Sebastian Haag, Fraunhofer-Institut für Produktionstechnologie (Germany)
Daniel Zontar, Fraunhofer-Institut für Produktionstechnologie (Germany)
Sebastian Sauer, Fraunhofer-Institut für Produktionstechnologie (Germany)
Christian Wenzel, Fraunhofer-Institut für Produktionstechnologie (Germany)
Christian Brecher, Fraunhofer-Institut für Produktionstechnologie (Germany)


Published in SPIE Proceedings Vol. 9346:
Components and Packaging for Laser Systems
Alexei L. Glebov; Paul O. Leisher, Editor(s)

© SPIE. Terms of Use
Back to Top