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Proceedings Paper

Whole field strain measurement in critical thin adhesive layer of single- and double-sided repaired CFRP panel using DIC
Author(s): Mohammad Kashfuddoja; M. Ramji
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Paper Abstract

In the present work, the behavior of thin adhesively layer in patch repaired carbon fiber reinforced polymer (CFRP) panel under tensile load is investigated experimentally using digital image correlation (DIC) technique. The panel is made of Carbon/epoxy composite laminate and the stacking sequence in the panel is [0º]4. A circular hole of 10 mm diameter (d) is drilled at the center of the panel to mimic the case of low velocity impact damage removal. The panel with open hole is repaired with double sided (symmetrical) and single sided (unsymmetrical) rectangular patch made of same panel material having stacking sequence of [0º]3. Araldite 2011 is used for bonding the patch onto the panel over the damaged area. The global behavior of thin adhesive layer is examined by analyzing whole field strain distribution using DIC. Longitudinal, peel and shear strain field in both double and single sided repair configuration is studied and a compression is made between them. An estimate of shear transfer length which is an essential parameter in arriving at an appropriate overlap length in patch design is proposed from DIC and FEA. Damage development, failure mechanism and load displacement behavior is also investigated. The experimental results are compared with the numerical predictions.

Paper Details

Date Published: 4 March 2015
PDF: 6 pages
Proc. SPIE 9302, International Conference on Experimental Mechanics 2014, 93021A (4 March 2015); doi: 10.1117/12.2079142
Show Author Affiliations
Mohammad Kashfuddoja, Indian Institute of Technology Hyderabad (India)
M. Ramji, Indian Institute of Technology Hyderabad (India)


Published in SPIE Proceedings Vol. 9302:
International Conference on Experimental Mechanics 2014
Chenggen Quan; Kemao Qian; Anand Asundi; Fook Siong Chau, Editor(s)

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