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Proceedings Paper

Silicon photonic devices based on SOI/bulk-silicon platforms for chip-level optical interconnects
Author(s): Gyungock Kim; In Gyoo Kim; Sanghoon Kim; Jiho Joo; Ki-Seok Jang; Sun Ae Kim; Jin Hyuk Oh; Jeong Woo Park; Myung-Joon Kwack; Jaegyu Park; Hyundai Park; Gun Sik Park; Sanggi Kim
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Paper Abstract

Based on either a SOI wafer or a bulk-silicon wafer, we discuss silicon photonic devices and integrations for chip-level optical interconnects. We present the low-voltage silicon PICs on a SOI wafer, where Si modulators and Ge-on-Si photodetectors are monolithically-integrated for intra-chip or inter-chip interconnects over 40 Gb/s. For future chip-level integration, the 50 Gb/s small-sized depletion-type MZ modulator with the vertically-dipped PN-depletion-junction (VDJ) is also presented. We report vertical-illumination-type Ge photodetectors on bulk-silicon wafers, with high performances up to 50 Gb/s. We present the bulk-silicon platform for practical implementation of chip-level interconnects, and the performance of the photonic transceiver silicon chip.

Paper Details

Date Published: 3 April 2015
PDF: 7 pages
Proc. SPIE 9368, Optical Interconnects XV, 93680Z (3 April 2015); doi: 10.1117/12.2078493
Show Author Affiliations
Gyungock Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
In Gyoo Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sanghoon Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jiho Joo, Electronics and Telecommunications Research Institute (Korea, Republic of)
Ki-Seok Jang, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sun Ae Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jin Hyuk Oh, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jeong Woo Park, Electronics and Telecommunications Research Institute (Korea, Republic of)
Myung-Joon Kwack, Electronics and Telecommunications Research Institute (Korea, Republic of)
Jaegyu Park, Electronics and Telecommunications Research Institute (Korea, Republic of)
Hyundai Park, Electronics and Telecommunications Research Institute (Korea, Republic of)
Gun Sik Park, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sanggi Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)


Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)

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