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Proceedings Paper

EUV lithography: progress, challenges, and outlook
Author(s): S. Wurm
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Paper Abstract

Extreme Ultraviolet Lithography (EUVL) has been in the making for more than a quarter century. The first EUVL production tools have been delivered over the past year and chip manufacturers and suppliers are maturing the technology in pilot line mode to prepare for high volume manufacturing (HVM). While excellent progress has been made in many technical and business areas to prepare EUVL for HVM introduction, there are still critical technical and business challenges to be addressed before the industry will be able to use EUVL in HVM.

Paper Details

Date Published: 17 October 2014
PDF: 7 pages
Proc. SPIE 9231, 30th European Mask and Lithography Conference, 923103 (17 October 2014); doi: 10.1117/12.2076766
Show Author Affiliations
S. Wurm, SEMATECH Inc. (United States)


Published in SPIE Proceedings Vol. 9231:
30th European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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